Preprint / physics.ins-det / hep-ex arXiv:0901.4741

Development of Vertically Integrated Circuits for ILC Vertex Detectors

Lipton, Ronald


Abstract: We report on studies of vertically interconnected electronics (3D) performed by the Fermilab pixel group over the past two years. These studies include exploration of interconnect technology, backside thinning and laser annealing, the production of the first 3D chip for particle physics, the VIP, and plans for a commercial two-tier 3D fabrication run.

Note: Comments: Talk given at the 2008 Linear Collider Workshop, 7 pages, 4 figures

The record appears in these collections:
Documentation > Articles & Preprints > Preprints


 Record created 2009-02-20, last modified 2009-02-20

Rate this document:

Rate this document:
(Not yet reviewed)