2025-07-31 06:15 |
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2025-07-31 06:15 |
Feasibility study of the Alice fixed-target experiment with HL-LHC lead ion beams based on crystal-assisted beam Halo splitting
/ Patecki, Marcin (Warsaw U. of Tech. (main)) ; Monikowska, Marta (Warsaw U. of Tech. (main))
The Large Hadron Collider (LHC) at the European Organization for Nuclear Research (CERN) is the world's largest and most powerful particle accelerator, colliding beams of protons and lead ions at energies up to 7 ZTeV. ALICE is one of the detector experiments optimized for heavy-ion collisions.A fixed-target experiment in ALICE is considered to collide a portion of the beam halo, split using a bent crystal, with an internal target placed a few meters upstream of the detector. [...]
2024 - 4 p.
- Published in : JACoW IPAC 2024 (2024) MOPC21
Fulltext: PDF;
In : 15th International Particle Accelerator Conference (IPAC 2024), Nashville, TN, United States, 19 - 24 May 2024, pp.MOPC21
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2025-07-31 06:15 |
Test beam performance of a novel RICH detector with timing capabilities for the future ALICE 3 PID system at LHC
/ Mazziotta, M N (INFN, Bari) ; Congedo, L (INFN, Bari) ; De Robertis, G (INFN, Bari) ; Di Mauro, A (CERN) ; Licciulli, F (INFN, Bari) ; Lorusso, L (INFN, Bari ; Bari U. ; Bari Polytechnic) ; Martinengo, P (CERN) ; Nappi, E (INFN, Bari) ; Nicassio, N (INFN, Bari ; Bari U. ; Bari Polytechnic) ; Panzarini, G (INFN, Bari ; Bari U. ; Bari Polytechnic) et al.
The ALICE Collaboration is proposing a completely new apparatus, ALICE 3, for the LHC Run 5 and beyond. A key subsystem for charged particle identification will be a Ring-Imaging Cherenkov (RICH) detector consisting of an aerogel radiator and a photosensitive surface based on Silicon Photomultiplier (SiPM) arrays in a proximity-focusing configuration. [...]
2025 - 8 p.
- Published in : JINST
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2025-07-30 04:37 |
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2025-07-30 04:21 |
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2025-07-24 04:46 |
Applications of CMOS Technology at the ALICE Experiment
/ Colella, Domenico (Bari Polytechnic ; Western Cape U.)
/ALICE Collaboration
Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing significant advances over the last decade in terms of integration densities, radiation hardness and readout speed. [...]
arXiv:2408.02448.-
2025-04-24 - 6 p.
- Published in : PoS: TIPP2023 (2025) , pp. 120
Fulltext: document - PDF; 2408.02448 - PDF;
In : 6th International Conference on Technology and Instrumentation in Particle Physics (TIPP 2023), Cape Town, Western Cape, South Africa, 4 - 8 Sep 2023, pp.120
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2025-07-24 04:25 |
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2025-07-19 09:21 |
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2025-07-18 06:05 |
TCAD and charge transport simulations of MAPS in 65 nm for the ALICE ITS3
/ Sanna, I (Munich, Tech. U. ; CERN) ; Lemoine, C (CERN ; Strasbourg, IPHC) ; Borghello, G (CERN) ; Snoeys, W (CERN)
/ALICE Collaboration
As part of the upgrade to the Inner Tracking System 3 (ITS3) for ALICE and the strategicR&D; programme of the CERN EP department, stitched Monolithic Active Pixel Sensors (MAPS) arebeing developed using a 65 nm CMOS imaging process. Several sensor prototypes were characterizedin laboratory using radioactive sources, particularly the $^{55}$Fe source, which was extensivelyused. [...]
2025 - 7 p.
- Published in : JINST 20 (2025) C06032
Fulltext: PDF;
In : 11th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL 2024), Strasbourg, France, 18 - 22 Nov 2024, pp.C06032
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2025-07-15 06:44 |
Yield, noise and timing studies of ALICE ITS3 stitched sensor test structures: The MOST
/ ALICE Collaboration
In the LHC long shutdown 3, the ALICE experiment upgrades the inner layers of its Inner Tracker System with three layers of wafer-scale stitched sensors bent around the beam pipe. Two stitched sensor evaluation structures, the MOnolithic Stitched Sensor (MOSS) and MOnolithic Stitched Sensor with Timing (MOST) allow the study of yield dependence on circuit density, power supply segmentation, stitching demonstration for power and data transmission, performance dependence on reverse bias, charge collection performance, parameter uniformity across the chip, and performance of wafer-scale data transmission. [...]
arXiv:2507.16409.-
2025-06-25 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1080 (2025) 170764
Fulltext: Publication - PDF; 2507.16409 - PDF;
In : 17th Vienna Conference on Instrumentation (VCI2025), Vienna, Austria, 17 - 21 Feb 2025, pp.170764
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